公开(公告)号：US20220195243A1

公开(公告)日：2022-06-23

申请号：US17552932

申请日：2021-12-16

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Hyun Goo KONG ,  Yun Su KIM

IPC: C09G1/02

Abstract: A polishing slurry composition is provided. The polishing slurry composition includes polishing particles, a first polishing inhibitor containing a hydrophobic amino acid, and a second polishing inhibitor containing a cyclic polymer, and the first polishing inhibitor and the second polishing inhibitor are different.

公开(公告)号：US20220127495A1

公开(公告)日：2022-04-28

申请号：US17511582

申请日：2021-10-27

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Hyun Goo KONG ,  Eun Jin LEE

IPC: C09G1/02 ,  C09K3/14

Abstract: A polishing slurry composition is provided. The polishing slurry composition includes abrasive particles, an oxidizer, an iron-containing catalyst, and a stabilizer, and a retention rate of the oxidizer according to Equation 1 is 70% or greater. Retention rate (%) of oxidizer=(concentration (%) of oxidizer after 7 days at room temperature×100)/(initial concentration (%) of oxidizer in polishing slurry composition)  [Equation 1]

公开(公告)号：US20250002755A1

公开(公告)日：2025-01-02

申请号：US18684241

申请日：2022-08-08

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Hyun Goo KONG ,  Yun Su KIM

IPC: C09G1/02 ,  C09K3/14

Abstract: The present invention relates to a slurry composition for metal polishing, comprising: colloidal silica; and an oxidizing agent; and at least one selected from among a polishing catalyst, a metal polishing enhancer, a polishing inhibitor, and a dishing and erosion reducer, wherein the colloidal silica has a particle size distribution of colloidal silica according to equation 1.

公开(公告)号：US20210269675A1

公开(公告)日：2021-09-02

申请号：US17184620

申请日：2021-02-25

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Hyun Goo KONG ,  In Seol HWANG

IPC: C09G1/02 ,  C09K13/00 ,  C09K13/04

Abstract: A slurry composition for chemical mechanical polishing (CMP) is provided. The slurry composition for CMP includes abrasive particles, an oxidizer, and a carbon polishing inhibitor.