Invention Application
- Patent Title: 3D PRINTING DEVICE, AND METHOD FOR PREPARING 3D PRINTED STRUCTURE
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Application No.: US17431244Application Date: 2019-03-04
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Publication No.: US20220134635A1Publication Date: 2022-05-05
- Inventor: Lei Wu , Yanlin Song
- Applicant: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Haidian District, Beijing
- Assignee: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Haidian District, Beijing
- Priority: CN201910120618.4 20190218
- International Application: PCT/CN2019/076789 WO 20190304
- Main IPC: B29C64/112
- IPC: B29C64/112 ; B33Y10/00
Abstract:
Disclosed are a 3D printing device, and a method for preparing a 3D printed structure. The device comprises a curing system, and a curing pattern player, a flat curing surface with de-wettability, and a receiving base capable of moving upwards and away from the flat curing surface, with same being successively arranged above the curing system, wherein a curing medium provided by the curing system passes through the curing pattern, so that ink between the flat curing surface and the receiving base is cured.
Information query
IPC分类:
