公开(公告)号：US20250121555A1

公开(公告)日：2025-04-17

申请号：US18999708

申请日：2024-12-23

Applicant: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES

Inventor： Lei Wu ,  Yanlin Song

IPC: B29C64/112 ,  B33Y10/00

Abstract: Disclosed are a 3D printing device, and a method for preparing a 3D printed structure. The device comprises a curing system (1), and a curing pattern player (6), a flat curing surface (2) with dewettability, and a receiving base (4) capable of moving upwards and away from the flat curing surface, with same being successively arranged above the curing system (1), wherein a curing medium provided by the curing system (1) passes through the curing pattern, so that ink between the flat curing surface (2) and the receiving base (4) is cured.

公开(公告)号：US20220134635A1

公开(公告)日：2022-05-05

申请号：US17431244

申请日：2019-03-04

Applicant: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES

Inventor： Lei Wu ,  Yanlin Song

IPC: B29C64/112 ,  B33Y10/00

Abstract: Disclosed are a 3D printing device, and a method for preparing a 3D printed structure. The device comprises a curing system, and a curing pattern player, a flat curing surface with de-wettability, and a receiving base capable of moving upwards and away from the flat curing surface, with same being successively arranged above the curing system, wherein a curing medium provided by the curing system passes through the curing pattern, so that ink between the flat curing surface and the receiving base is cured.