Invention Application
- Patent Title: METHOD FOR SUPPORTING THIOL GROUP-INCLUDING COMPOUND
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Application No.: US17434039Application Date: 2020-02-27
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Publication No.: US20220135705A1Publication Date: 2022-05-05
- Inventor: Takuma SUZUKI , Dai MURATA , Masakatsu NISHIHACHIJYO , Hisako YAURA
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka-shi, Osaka
- Priority: JP2019-057650 20190326
- International Application: PCT/JP2020/008017 WO 20200227
- Main IPC: C07K17/14
- IPC: C07K17/14 ; C07K1/22

Abstract:
The objective of the present invention is to provide a method for efficiently supporting a thiol group-including compound on an insoluble base material. The method for supporting a thiol group-including compound on an insoluble base material according to the present invention is characterized in comprising Step A: treating the thiol group-including compound with a thiol group-including organic reducing agent and an inorganic reducing agent, and Step B: contacting a reaction liquid of said Step A with the insoluble base material.
Public/Granted literature
- US12240919B2 Method for supporting thiol group-including compound Public/Granted day:2025-03-04
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