Invention Application
- Patent Title: POLYAMIDE MOLDING COMPOSITION FOR HIGH-GLOSS APPLICATIONS
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Application No.: US17435071Application Date: 2020-03-04
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Publication No.: US20220135796A1Publication Date: 2022-05-05
- Inventor: Rainer Xalter , Torsten Erdmann , Xaver Hopfenspirger , Stefan Milimonka
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Priority: EP19161124.3 20190306
- International Application: PCT/EP2020/055702 WO 20200304
- Main IPC: C08L77/06
- IPC: C08L77/06 ; C08J5/18

Abstract:
Described herein is a thermoplastic molding material including a) a mixture of 100 parts by weight of polyamide including aliphatic unbranched C10-12-foundational units and 5 to 100 parts by weight of polyamide 6 and/or polyamide 6/6,6 as component A), and b) 0% to 30% by weight, based on component A), of further additives as component B), including 0% to 20% by weight, based on component A), of inorganic fillers and reinforcing materials.
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