公开(公告)号：US20220135796A1

公开(公告)日：2022-05-05

申请号：US17435071

申请日：2020-03-04

Applicant: BASF SE

Inventor： Rainer Xalter ,  Torsten Erdmann ,  Xaver Hopfenspirger ,  Stefan Milimonka

IPC: C08L77/06 ,  C08J5/18

Abstract: Described herein is a thermoplastic molding material including a) a mixture of 100 parts by weight of polyamide including aliphatic unbranched C10-12-foundational units and 5 to 100 parts by weight of polyamide 6 and/or polyamide 6/6,6 as component A), and b) 0% to 30% by weight, based on component A), of further additives as component B), including 0% to 20% by weight, based on component A), of inorganic fillers and reinforcing materials.