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公开(公告)号:US20220135796A1
公开(公告)日:2022-05-05
申请号:US17435071
申请日:2020-03-04
Applicant: BASF SE
Inventor: Rainer Xalter , Torsten Erdmann , Xaver Hopfenspirger , Stefan Milimonka
Abstract: Described herein is a thermoplastic molding material including a) a mixture of 100 parts by weight of polyamide including aliphatic unbranched C10-12-foundational units and 5 to 100 parts by weight of polyamide 6 and/or polyamide 6/6,6 as component A), and b) 0% to 30% by weight, based on component A), of further additives as component B), including 0% to 20% by weight, based on component A), of inorganic fillers and reinforcing materials.