公开(公告)号：US20230173794A1

公开(公告)日：2023-06-08

申请号：US17998985

申请日：2021-05-17

Applicant: BASF SE

Inventor： Patrick Spies ,  Daniela Longo-Schedel ,  Rene Holschuh ,  Xaver Hopfenspirger

IPC: B32B27/06 ,  B32B5/20 ,  B32B27/08 ,  B32B27/34 ,  B32B15/08 ,  B32B27/32 ,  B29C44/04

CPC classification number: B32B27/065 ,  B32B5/20 ,  B32B27/08 ,  B32B27/34 ,  B32B15/08 ,  B32B27/32 ,  B29C44/04 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2307/72

Abstract: The present invention relates to a polymer foam laminate structure (1), comprising—a first solid layer (101) having a density of more than 1000 g/l, which is covered by at least one first functional layer (103), —a polymeric foam layer (105) provided on the at least one first functional layer (103), —a second solid layer (109) having a density of more than 1000 g/l, which is covered by at least one second functional layer (107), the at least one second functional layer (107) being in contact with the polymeric foam layer (103), wherein the polymeric foam layer (105) has a density of 20 g/l to less than 1000 g/l. The present invention further pertains a method for preparing a polymer foam laminate structure (1) and a composite component (1000) inter alia comprising the polymer foam laminate structure (1).

公开(公告)号：US20220135796A1

公开(公告)日：2022-05-05

申请号：US17435071

申请日：2020-03-04

Applicant: BASF SE

Inventor： Rainer Xalter ,  Torsten Erdmann ,  Xaver Hopfenspirger ,  Stefan Milimonka

IPC: C08L77/06 ,  C08J5/18

Abstract: Described herein is a thermoplastic molding material including a) a mixture of 100 parts by weight of polyamide including aliphatic unbranched C10-12-foundational units and 5 to 100 parts by weight of polyamide 6 and/or polyamide 6/6,6 as component A), and b) 0% to 30% by weight, based on component A), of further additives as component B), including 0% to 20% by weight, based on component A), of inorganic fillers and reinforcing materials.