Invention Application
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
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Application No.: US17308273Application Date: 2021-05-05
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Publication No.: US20220139618A1Publication Date: 2022-05-05
- Inventor: Byung Woo Kang , Bon Seok Koo , Jeong Ryeol Kim , Jung Min Kim , Jae Seok Yi , Ji Hye Han , Hye Jin Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0145462 20201103
- Main IPC: H01G4/015
- IPC: H01G4/015 ; H01G4/30 ; H01G4/248

Abstract:
A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
Public/Granted literature
- US11694844B2 Multilayer electronic component Public/Granted day:2023-07-04
Information query