- 专利标题: SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
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申请号: US17577361申请日: 2022-01-17
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公开(公告)号: US20220140091A1公开(公告)日: 2022-05-05
- 发明人: Takashi YOSHIMURA , Yuichi ONOZAWA , Hiroshi TAKISHITA , Misaki MEGURO , Motoyoshi KUBOUCHI , Naoko KODAMA
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kanagawa
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2018-051655 20180319
- 主分类号: H01L29/36
- IPC分类号: H01L29/36 ; H01L21/22 ; H01L21/265 ; H01L21/322 ; H01L29/06 ; H01L29/12 ; H01L29/739 ; H01L29/78 ; H01L29/861
摘要:
Provided is a semiconductor device including a semiconductor substrate; a hydrogen donor that is provide inside the semiconductor substrate in a depth direction, has a doping concentration that is higher than a doping concentration of a dopant of the semiconductor substrate, has a doping concentration distribution peak at a first position that is a predetermined distance in the depth direction of the semiconductor substrate away from one main surface of the semiconductor substrate, and has a tail of the doping concentration distribution where the doping concentration is lower than at the peak, farther on the one main surface side than where the first position is located; and a crystalline defect region having a crystalline defect density center peak at a position shallower than the first position, in the depth direction of the semiconductor substrate.
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