Invention Application
- Patent Title: On-Die Termination
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Application No.: US17527511Application Date: 2021-11-16
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Publication No.: US20220140828A1Publication Date: 2022-05-05
- Inventor: Ian Shaeffer
- Applicant: Rambus Inc.
- Applicant Address: US CA San Jose
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H03K19/00
- IPC: H03K19/00 ; G11C5/06 ; G11C7/10 ; H03K19/0175 ; G11C11/4063 ; G11C11/413 ; G11C16/06 ; G11C5/14

Abstract:
Local on-die termination controllers for effecting termination of a high-speed signaling links simultaneously engage on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link. A termination control bus is coupled to memory devices on a module, and provides for peer-to-peer communication of termination control signals.
Public/Granted literature
- US11742855B2 On-die termination Public/Granted day:2023-08-29
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