Invention Application
- Patent Title: SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR PRODUCTION METHOD, AND SUBSTRATE PROCESSING APPARATUS
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Application No.: US17440212Application Date: 2020-01-24
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Publication No.: US20220148888A1Publication Date: 2022-05-12
- Inventor: Kenji KOBAYASHI , Masanobu SATO , Yuta NAKANO
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Priority: JP2019-053333 20190320
- International Application: PCT/JP2020/002540 WO 20200124
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
In a substrate processing method, a substrate with a pattern including a plurality of structures is processed. The substrate processing method includes a step of increasing hydrophilicity of respective surfaces of the structures, by executing predetermined processing on the structures with a non-liquid substance, from that before execution of the predetermined processing; and a step of supplying a processing liquid to the structures after the step of increasing hydrophilicity.
Information query
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