Invention Application
- Patent Title: THIN FILM TRANSISTORS HAVING U-SHAPED FEATURES
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Application No.: US17580550Application Date: 2022-01-20
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Publication No.: US20220149209A1Publication Date: 2022-05-12
- Inventor: Gilbert DEWEY , Aaron LILAK , Van H. LE , Abhishek A. SHARMA , Tahir GHANI , Willy RACHMADY , Rishabh MEHANDRU , Nazila HARATIPOUR , Jack T. KAVALIEROS , Benjamin CHU-KUNG , Seung Hoon SUNG , Shriram SHIVARAMAN
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66

Abstract:
Thin film transistors having U-shaped features are described. In an example, integrated circuit structure including a gate electrode above a substrate, the gate electrode having a trench therein. A channel material layer is over the gate electrode and in the trench, the channel material layer conformal with the trench. A first source or drain contact is coupled to the channel material layer at a first end of the channel material layer outside of the trench. A second source or drain contact is coupled to the channel material layer at a second end of the channel material layer outside of the trench.
Public/Granted literature
- US11721735B2 Thin film transistors having U-shaped features Public/Granted day:2023-08-08
Information query
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