Invention Application
- Patent Title: MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
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Application No.: US17337850Application Date: 2021-06-03
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Publication No.: US20220159827A1Publication Date: 2022-05-19
- Inventor: Wonseop LEE , Hwanwook PARK , Jeonghoon BAEK , Dohyung KIM , Seunghee MUN , Dongyoon SEO , Jinoh AHN
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0152459 20201116
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L25/11 ; H01L25/065 ; G11C5/04 ; G11C5/06 ; G11C8/18 ; G06F13/40

Abstract:
A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.
Public/Granted literature
- US11477880B2 Module board and memory module including the same Public/Granted day:2022-10-18
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