发明申请
- 专利标题: THREE-DIMENSIONAL SUPERCONDUCTING QUBIT AND A METHOD FOR MANUFACTURING THE SAME
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申请号: US17495085申请日: 2021-10-06
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公开(公告)号: US20220164690A1公开(公告)日: 2022-05-26
- 发明人: Caspar Ockeloen-Korppi , Tianyi Li , Wei Liu , Vasilii Sevriuk , Tiina Naaranoja , Mate Jenei , Jan Goetz , Kuan Yen Tan , Mikko Möttönen , Kok Wai Chan
- 申请人: IQM Finland Oy
- 申请人地址: FI Espoo
- 专利权人: IQM Finland Oy
- 当前专利权人: IQM Finland Oy
- 当前专利权人地址: FI Espoo
- 优先权: EP20209130.2 20201123
- 主分类号: G06N10/00
- IPC分类号: G06N10/00 ; H01L39/22 ; H01L39/24 ; H01L39/02 ; H01L27/18
摘要:
A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.
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