公开(公告)号：US11907805B2

公开(公告)日：2024-02-20

申请号：US17495085

申请日：2021-10-06

申请人： IQM Finland Oy

发明人： Caspar Ockeloen-Korppi ,  Tianyi Li ,  Wei Liu ,  Vasilii Sevriuk ,  Tiina Naaranoja ,  Mate Jenei ,  Jan Goetz ,  Kuan Yen Tan ,  Mikko Möttönen ,  Kok Wai Chan

IPC分类号： G06N10/00 ,  H10N60/12 ,  H10N60/80 ,  H10N60/01 ,  H10N69/00

CPC分类号： G06N10/00 ,  H10N60/0912 ,  H10N60/12 ,  H10N60/805 ,  H10N69/00

摘要： A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.

公开(公告)号：US20220164690A1

公开(公告)日：2022-05-26

申请号：US17495085

申请日：2021-10-06

申请人： IQM Finland Oy

发明人： Caspar Ockeloen-Korppi ,  Tianyi Li ,  Wei Liu ,  Vasilii Sevriuk ,  Tiina Naaranoja ,  Mate Jenei ,  Jan Goetz ,  Kuan Yen Tan ,  Mikko Möttönen ,  Kok Wai Chan

IPC分类号： G06N10/00 ,  H01L39/22 ,  H01L39/24 ,  H01L39/02 ,  H01L27/18

摘要： A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.

公开(公告)号：US20220012617A1

公开(公告)日：2022-01-13

申请号：US17139715

申请日：2020-12-31

申请人： IQM Finland Oy

发明人： Juha Hassel ,  Wei Liu ,  Vasilii Sevriuk ,  Johannes Heinsoo ,  Mate Jenei ,  Manjunath Venkatesh ,  Tianyi Li ,  Kok Wai Chan ,  Kuan Yen Tan ,  Mikko Möttönen

IPC分类号： G06N10/00

摘要： A quantum computing circuit is disclosed herein. An example quantum computing circuit includes a first chip with at least one qubit thereon. The quantum computing circuit also includes a second chip with at least other quantum circuit elements other than qubits thereon. The first chip and the second chip are stacked together in a flip-chip configuration and attached to each other with bump bonding that includes bonding bumps.