Invention Application
- Patent Title: METHODS FOR TRANSFER OF MICRO-DEVICES
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Application No.: US17670374Application Date: 2022-02-11
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Publication No.: US20220165789A1Publication Date: 2022-05-26
- Inventor: Mingwei Zhu , Sivapackia Ganapathiappan , Boyi Fu , Hou T. Ng , Nag B. Patibandla
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/00 ; H01L21/683 ; H01L23/00 ; H01L21/66 ; H01L33/48
Abstract:
An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate
Public/Granted literature
- US11843025B2 Methods for transfer of micro-devices Public/Granted day:2023-12-12
Information query
IPC分类:
