Invention Application
- Patent Title: SEMICONDUCTOR DEVICE WITH DOPED STRUCTURE
-
Application No.: US17650867Application Date: 2022-02-14
-
Publication No.: US20220165847A1Publication Date: 2022-05-26
- Inventor: Miao-Syuan FAN , Pei-Wei LEE , Ching-Hua LEE , Jung-Wei LEE
- Applicant: Taiwan Semiconductor Manufacturing Co.,Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co.,Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co.,Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L27/088 ; H01L29/78 ; H01L29/66 ; H01L29/417 ; H01L21/8234 ; H01L29/423 ; H01L29/10 ; H01L29/40

Abstract:
The present disclosure relates to a semiconductor device includes first and second source/drain (S/D) regions doped with lead (Pb) at a first dopant concentration. The semiconductor device also includes a channel region between the first and second S/D regions, where the channel region is doped with Pb at a second dopant concentration that is lower than the first dopant concentration. The semiconductor device further includes first and second S/D contacts in contact with the first and second S/D regions, respectively. The semiconductor device also includes a gate electrode over the channel region.
Public/Granted literature
- US11990512B2 Semiconductor device with doped structure Public/Granted day:2024-05-21
Information query
IPC分类: