Invention Application
- Patent Title: HIGH DENSITY CONNECTOR ASSEMBLY
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Application No.: US17593569Application Date: 2020-03-23
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Publication No.: US20220166157A1Publication Date: 2022-05-26
- Inventor: YunLong Qiao , Saujit Bandhu , Kok Hoe Lee , Vincent Tan
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- International Application: PCT/IB2020/052715 WO 20200323
- Main IPC: H01R12/62
- IPC: H01R12/62 ; H05K1/11

Abstract:
A connector assembly comprising a housing, first and second circuit boards, and substantially flat cables. The housing includes a mating end for mating with a mating connector and an opposite cable end for receiving a cable. The first and second circuit boards are disposed inside the housing. Each circuit board includes a plurality of conductive front pads disposed closer to the mating end of the housing and a plurality of conductive rear pads disposed closer to the cable end of the housing and electrically connected to the front pads. At least one front pad of the first circuit board faces, aligns with, and is electrically connected to, at least one rear pad of the second circuit board. The substantially flat cables include a plurality of conductors. The uninsulated front ends of the conductors of the cables terminate at the corresponding rear pads of the first circuit board.
Information query
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