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    SUBSTRATE FOR MOUNTING ELECTRICAL CONNECTOR
    3.
    发明申请
    SUBSTRATE FOR MOUNTING ELECTRICAL CONNECTOR 有权
    用于安装电气连接器的基板

    公开(公告)号：US20150319861A1

    公开(公告)日：2015-11-05

    申请号：US14649628

    申请日：2014-01-08

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Saujit Bandhu ,  YunLong Qiao ,  Vincent Tan

    IPC: H05K1/11 ,  H01R12/72

    CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K1/0228 ,  H05K1/111 ,  H05K2201/10189

    Abstract: A substrate comprises a first plurality of conductive pads disposed on a first side of the substrate and a different second plurality of conductive pads disposed on the first side of the substrate. Each conductive pad in the first plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSAS plug connector when the MicroSAS plug connector is mounted onto the substrate. Each conductive pad in the second plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSATA plug connector when the MicroSATA plug connector is mounted onto the substrate. At least one conductive pad belongs to both the first and second pluralities of conductive pads.

    Abstract translation: 衬底包括设置在衬底的第一侧上的第一多个导电焊盘和设置在衬底的第一侧上的不同的第二多个导电焊盘。 第一多个导电焊盘中的每个导电焊盘被配置成当MicroSAS插头连接器安装到基板上时与MicroSAS插头连接器的对应接触件进行电接触。 第二多个导电焊盘中的每个导电焊盘被配置成当MicroSATA插头连接器安装到衬底上时与MicroSATA插头连接器的相应触点电接触。 至少一个导电焊盘属于第一和第二多个导电焊盘。

    Connector assembly
    4.
    发明授权
    Connector assembly 有权

    公开(公告)号：US10535939B1

    公开(公告)日：2020-01-14

    申请号：US15998476

    申请日：2018-08-15

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： YunLong Qiao ,  Saujit Bandhu ,  Vincent Tan ,  Kok Hoe Lee

    IPC: H01R12/00 ,  H01R12/79 ,  H01R12/53 ,  H01R12/70

    Abstract: A connector assembly including a connector and first and second cables is described. The connector includes an insulative housing and a circuit board partially disposed in the housing. The circuit board includes a mating section and a termination section. The mating section includes a plurality of first contact pads and the termination section includes a plurality of second contact pads electrically connected to the first contact pads. The first and second cables include conductors having front ends terminated at the second contact pads. The housing is overmolded onto and encapsulates at least the front ends of the conductors and the termination section of the circuit board. The circuit board includes a back surface at a rear end of the circuit board and the housing includes a back surface at a cable end of the housing which may be substantially coplanar with the back surface of the circuit board.

    Substrate for mounting electrical connector
    7.
    发明授权
    Substrate for mounting electrical connector 有权
    用于安装电连接器的基板

    公开(公告)号：US09426888B2

    公开(公告)日：2016-08-23

    申请号：US14649628

    申请日：2014-01-08

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Saujit Bandhu ,  YunLong Qiao ,  Vincent Tan

    IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H01R12/00 ,  H01R12/72 ,  H05K1/02

    CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K1/0228 ,  H05K1/111 ,  H05K2201/10189

    Abstract: A substrate comprises a first plurality of conductive pads disposed on a first side of the substrate and a different second plurality of conductive pads disposed on the first side of the substrate. Each conductive pad in the first plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSAS plug connector when the MicroSAS plug connector is mounted onto the substrate. Each conductive pad in the second plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSATA plug connector when the MicroSATA plug connector is mounted onto the substrate. At least one conductive pad belongs to both the first and second pluralities of conductive pads.

    Abstract translation: 衬底包括设置在衬底的第一侧上的第一多个导电焊盘和设置在衬底的第一侧上的不同的第二多个导电焊盘。 第一多个导电焊盘中的每个导电焊盘被配置成当MicroSAS插头连接器安装到基板上时与MicroSAS插头连接器的对应接触件进行电接触。 第二多个导电焊盘中的每个导电焊盘被配置为当MicroSATA插头连接器安装到衬底上时与MicroSATA插头连接器的对应接触件进行电接触。 至少一个导电焊盘属于第一和第二多个导电焊盘。

    HIGH DENSITY CONNECTOR ASSEMBLY
    8.
    发明申请
    HIGH DENSITY CONNECTOR ASSEMBLY 有权

    公开(公告)号：US20220166157A1

    公开(公告)日：2022-05-26

    申请号：US17593569

    申请日：2020-03-23

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： YunLong Qiao ,  Saujit Bandhu ,  Kok Hoe Lee ,  Vincent Tan

    IPC: H01R12/62 ,  H05K1/11

    Abstract: A connector assembly comprising a housing, first and second circuit boards, and substantially flat cables. The housing includes a mating end for mating with a mating connector and an opposite cable end for receiving a cable. The first and second circuit boards are disposed inside the housing. Each circuit board includes a plurality of conductive front pads disposed closer to the mating end of the housing and a plurality of conductive rear pads disposed closer to the cable end of the housing and electrically connected to the front pads. At least one front pad of the first circuit board faces, aligns with, and is electrically connected to, at least one rear pad of the second circuit board. The substantially flat cables include a plurality of conductors. The uninsulated front ends of the conductors of the cables terminate at the corresponding rear pads of the first circuit board.

    HIGH DENSITY CONNECTOR ASSEMBLY
    9.
    发明申请
    HIGH DENSITY CONNECTOR ASSEMBLY 有权

    公开(公告)号：US20210159619A1

    公开(公告)日：2021-05-27

    申请号：US17248711

    申请日：2021-02-04

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： YunLong Qiao ,  Saujit Bandhu ,  Kok Hoe Lee ,  Vincent Tan

    IPC: H01R12/50 ,  H01R12/71 ,  H01R12/70

    Abstract: A connector assembly includes, a housing, a circuit board that includes a conductive front pad and a conductive rear pad electrically connected to the front pad, and a cable that includes an insulated conductor having a conductor surrounded by an insulating material. The conductor has a diameter not greater than 24 AWG. The uninsulated front end of the conductor is terminated at the rear pad and includes a preformed bend. The connector assembly also includes a recess formed in an external surface and on a lateral side of the housing. The recess is designed to receive and house a spring member of a pull tab that is assembled to the housing. The vertical separation between the recess and the circuit board is h, the average thickness of the cable is t, and h≥3t. The preformed bend may include first and second portions connected by a substantially flattened joint.

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