Invention Application
- Patent Title: INTERFACIAL TILT-RESISTANT BONDED ASSEMBLY AND METHODS FOR FORMING THE SAME
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Application No.: US17106884Application Date: 2020-11-30
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Publication No.: US20220173071A1Publication Date: 2022-06-02
- Inventor: Lin HOU , Peter RABKIN , Yangyin CHEN , Masaaki HIGASHITANI
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX ADDISON
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX ADDISON
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/18 ; H01L23/00 ; H01L25/00
Abstract:
A first bonding unit is provided, which includes a first substrate, a first passivation dielectric layer, and first bonding pads. A second bonding unit is provided, which includes a second substrate, a second passivation dielectric layer, and second bonding pads including bonding pillar structures. Solder material portions are formed on physically exposed surfaces of the first bonding pads. The second bonding unit is attached to the first bonding unit by bonding the at least one of the bonding pillar structures to a respective solder material portion.
Public/Granted literature
- US11348901B1 Interfacial tilt-resistant bonded assembly and methods for forming the same Public/Granted day:2022-05-31
Information query
IPC分类:
