Invention Application
- Patent Title: ADHESIVE COMPOSITION FOR DICING TAPE AND DICING TAPE COMPRISING THE SAME
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Application No.: US17598114Application Date: 2020-08-13
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Publication No.: US20220186092A1Publication Date: 2022-06-16
- Inventor: Da Ae KIM , Ji Ho HAN , Kwang Joo LEE , Eun Yeong KIM , Mi JANG
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2019-0119119 20190926,KR10-2020-0096318 20200731
- International Application: PCT/KR2020/095102 WO 20200813
- Main IPC: C09J133/08
- IPC: C09J133/08 ; C09J7/24 ; C09J11/06 ; H01L21/683
Abstract:
The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
Public/Granted literature
- US11932784B2 Adhesive composition for dicing tape and dicing tape comprising the same Public/Granted day:2024-03-19
Information query
IPC分类:
