公开(公告)号：US20210388244A1

公开(公告)日：2021-12-16

申请号：US17286673

申请日：2020-06-12

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong KIM ,  You Jin KYUNG ,  Kwang Joo LEE ,  Ji Ho HAN ,  Bora YEON ,  Mi JANG

IPC: C09J163/00 ,  H01L23/00 ,  C09J7/24

Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

公开(公告)号：US20220186092A1

公开(公告)日：2022-06-16

申请号：US17598114

申请日：2020-08-13

Applicant: LG CHEM, LTD.

Inventor： Da Ae KIM ,  Ji Ho HAN ,  Kwang Joo LEE ,  Eun Yeong KIM ,  Mi JANG

IPC: C09J133/08 ,  C09J7/24 ,  C09J11/06 ,  H01L21/683

Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

公开(公告)号：US20200369925A1

公开(公告)日：2020-11-26

申请号：US16959625

申请日：2019-01-11

Applicant: LG CHEM, LTD.

Inventor： Mi Seon YOON ,  Se Ra KIM ,  Kwang Joo LEE ,  Bora YEON ,  Sung Chan PARK ,  Eun Yeong KIM

IPC: C09J7/30 ,  C09J133/08 ,  C09J133/10 ,  C09J7/22 ,  H01L21/683

Abstract: The present invention relates to a back grinding tape including a polymer substrate and an adhesive layer, wherein the adhesive layer includes a (meth)acrylate resin containing 30 to 60% by weight of a repeating unit derived from a monomer or an oligomer having a glass transition temperature of 0° C. or higher, and wherein the adhesive layer has a glass transition temperature of −20° C. to 10° C., and a method of grinding wafers using the back grinding tape.

公开(公告)号：US20220154053A1

公开(公告)日：2022-05-19

申请号：US17599208

申请日：2020-08-14

Applicant: LG CHEM, LTD.

Inventor： Da Ae KIM ,  Ji Ho HAN ,  Kwang Joo LEE ,  Eun Yeong KIM ,  Mi JANG

IPC: C09J133/08 ,  C09J7/24 ,  C09J7/38

Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

公开(公告)号：US20210035847A1

公开(公告)日：2021-02-04

申请号：US16964364

申请日：2019-06-04

Applicant: LG CHEM, LTD.

Inventor： Mi Seon YOON ,  Sera KIM ,  Kwang Joo LEE ,  Bora YEON ,  Sang Hwan KIM ,  Eun Yeong KIM

IPC: H01L21/683 ,  H01L21/304 ,  C09J7/29

Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of −30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.

公开(公告)号：US20210002518A1

公开(公告)日：2021-01-07

申请号：US16969255

申请日：2019-03-07

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong KIM ,  Sera KIM ,  Kwang Joo LEE ,  Sang Hwan KIM ,  Sung Chan PARK ,  Mi Seon YOON

IPC: C09J7/29 ,  C09J133/08 ,  H01L21/683

Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.