Invention Application
- Patent Title: APPARATUS AND METHOD FOR HANDLING WAFER CARRIER DOORS
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Application No.: US17686278Application Date: 2022-03-03
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Publication No.: US20220189792A1Publication Date: 2022-06-16
- Inventor: Tsung-Sheng KUO , Yang-Ann CHU , Alan YANG , Vic HUANG , Hsu-Shui LIU , Jiun-Rong PAI
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/683 ; H01L21/68

Abstract:
An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.
Public/Granted literature
- US11784073B2 Apparatus and method for handling wafer carrier doors Public/Granted day:2023-10-10
Information query
IPC分类: