公开(公告)号：US20200343115A1

公开(公告)日：2020-10-29

申请号：US16927089

申请日：2020-07-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Shou-Wen KUO ,  Sheng-Hsiang CHUANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU

IPC: H01L21/67 ,  H01L21/677 ,  G01M3/38

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

公开(公告)号：US20180366357A1

公开(公告)日：2018-12-20

申请号：US16058400

申请日：2018-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Ko LIAO ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Sheng-Hsiang CHUANG ,  Shou-Wen KUO ,  Ya Hsun HSUEH

IPC: H01L21/67 ,  H01L21/687 ,  G06T7/00 ,  H04N5/225

Abstract: A system and method for inline detection of defects on a semiconductor wafer surface during a semiconductor device manufacturing process is disclosed herein. In one embodiment, a method includes: automatically transporting the wafer from a first processing station to an inspection station; scanning a wafer surface using a camera in the inspection station; generating at least one image of the wafer surface; analyzing the at least one image to detect defects on the wafer surface based on a set of predetermined criteria; if the wafer is determined to be defective, automatically transporting the wafer from the inspection station to a stocker; and if the wafer is determined to be not defective, automatically transporting the wafer to a second processing station for further processing in accordance with the semiconductor device manufacturing process.

公开(公告)号：US20160225649A1

公开(公告)日：2016-08-04

申请号：US14609038

申请日：2015-01-29

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chien-Fa LEE ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: H01L21/677 ,  B65G1/137 ,  B65G1/10

CPC classification number: H01L21/67775 ,  B65G1/137 ,  H01L21/67769

Abstract: A load port for a processing tool includes a carrier, a carrier actuator, an input table, an input table actuator, and a controller. The carrier has a plurality of cassette buffering spaces. The carrier is movable relative to the processing tool. The carrier actuator is operably connected to the carrier. The input table is configured to receive at least one cassette. The input table is movable relative to the carrier. The input table actuator is operably connected to the input table. The controller is configured to control the carrier actuator to move the carrier, such that one of the cassette buffering spaces is aligned with the input table, configured to control the input table actuator to move the input table with the cassette into the aligned cassette buffering space, and configured to control the input table to load the cassette into the aligned cassette buffering space.

Abstract translation: 用于加工工具的装载端口包括载体，载体致动器，输入工作台，输入工作台致动器和控制器。 载体具有多个盒缓冲空间。 承载件相对于处理工具是可移动的。 载体致动器可操作地连接到载体。 输入表被配置为接收至少一个盒。 输入表相对于载体是可移动的。 输入表致动器可操作地连接到输入表。 所述控制器被配置成控制所述载体致动器以移动所述载体，使得所述盒缓冲空间中的一个与所述输入台对准，所述输入台配置成控制所述输入台致动器以使所述输入台与所述盒移动到所述对准的盒缓冲空间 并且被配置为控制输入表以将盒装载到对准的盒缓冲空间中。

公开(公告)号：US20250096030A1

公开(公告)日：2025-03-20

申请号：US18962784

申请日：2024-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ren-Hau WU ,  Yan-Han CHEN ,  Cheng-Kang HU ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/687 ,  B25J9/16 ,  B65G47/90 ,  H01L21/67 ,  H04N23/56

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

公开(公告)号：US20220359248A1

公开(公告)日：2022-11-10

申请号：US17874174

申请日：2022-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Guan-Wei HUANG ,  Chih-Hung HUANG ,  Yang-Ann CHU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/02

Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

公开(公告)号：US20220059376A1

公开(公告)日：2022-02-24

申请号：US16996211

申请日：2020-08-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Becky LIAO ,  Sheng-Hsiang CHUANG ,  Cheng-Kang HU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: H01L21/67 ,  G06T7/00 ,  H04N7/18 ,  H04N5/225 ,  H04N5/232 ,  G01B11/14

Abstract: A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.

公开(公告)号：US20190244343A1

公开(公告)日：2019-08-08

申请号：US16204387

申请日：2018-11-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Hsiang CHUANG ,  Becky LIAO ,  Cheng-Kang HU ,  Shou-Wen KUO ,  Jiun-Rong PAI ,  Hsu-Shui LIU

IPC: G06T7/00 ,  G06T7/62 ,  G06T5/00 ,  G01B11/30

CPC classification number: G06T7/0004 ,  G01B11/30 ,  G06T5/005 ,  G06T7/62 ,  G06T2207/10008

Abstract: A method for scanning and analyzing a surface, the method comprising: receiving a piece of equipment with a target surface for inspection; receiving an input from a user; determining at least one scan parameter based on the user input; scanning the target surface using an optical detector in accordance with the at least one scan parameter; generating an image of the target surface; correcting the image of the target surface to remove at least one undesired feature to generate a corrected image based on the at least one scan parameter; and analyzing the corrected image to determine at least one geometric parameter of the target surface.

公开(公告)号：US20250062153A1

公开(公告)日：2025-02-20

申请号：US18936869

申请日：2024-11-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa LEE ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO ,  Jian-Hung CHEN ,  M.C. LIN ,  C.C. CHIEN ,  Hsuan LEE ,  Boris HUANG

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/304 ,  H01L21/66

Abstract: A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.

公开(公告)号：US20240190596A1

公开(公告)日：2024-06-13

申请号：US18513542

申请日：2023-11-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Yang-Ann CHU ,  Chieh-Chun LIN ,  Shine CHEN

IPC: B65B5/04 ,  B65G47/28 ,  G01N21/95 ,  G06T7/00

CPC classification number: B65B5/045 ,  G01N21/9501 ,  G06T7/0004 ,  B65G47/28

Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

公开(公告)号：US20210257247A1

公开(公告)日：2021-08-19

申请号：US17308786

申请日：2021-05-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa LEE ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO ,  Jian-Hung CHENG ,  M.C. LIN ,  C.C. CHIEN ,  Hsuan LEE ,  Boris HUANG

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.