公开(公告)号：US20190163170A1

公开(公告)日：2019-05-30

申请号：US15883497

申请日：2018-01-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Yung-Lin HSU ,  Richard LIN ,  Chiung-Min LIN ,  Alan YANG

IPC: G05B19/418

CPC classification number: G05B19/41815 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67703 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67736

Abstract: In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.

公开(公告)号：US20200227283A1

公开(公告)日：2020-07-16

申请号：US16834290

申请日：2020-03-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yang-Ann CHU ,  Alan YANG ,  Vic HUANG ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/677 ,  H01L21/683 ,  H01L21/68

Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

公开(公告)号：US20220189792A1

公开(公告)日：2022-06-16

申请号：US17686278

申请日：2022-03-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yang-Ann CHU ,  Alan YANG ,  Vic HUANG ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/677 ,  H01L21/683 ,  H01L21/68

Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.