Invention Application
- Patent Title: ADHESION PROMOTING PHOTORESIST UNDERLAYER COMPOSITION
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Application No.: US17127434Application Date: 2020-12-18
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Publication No.: US20220197143A1Publication Date: 2022-06-23
- Inventor: Joshua Kaitz , Ke Yang , Keren Zhang , Li Cui , James F. Cameron , Dan B. Millward , Shintaro Yamada
- Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Applicant Address: US MA Marlborough
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MA Marlborough
- Main IPC: G03F7/11
- IPC: G03F7/11 ; C09D171/00 ; C08G65/40

Abstract:
A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14): D-(L1-Ar—[X]n)m (14); and a solvent, wherein, in formula (14), D is a substituted or unsubstituted C1-60 organic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted C1-60 organic group; each L1 is independently a single bond or a divalent linking group, when L1 is a single bond, D may be a substituted or unsubstituted C3-30 cycloalkyl or substituted or unsubstituted C1-20 heterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic C5-60 aromatic group, each X is independently —OR30, —SR31, or —NR32R33, m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and R30 to R33 are as provided herein.
Information query
IPC分类: