PHOTOACTIVE COMPOUNDS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS

    公开(公告)号:US20240027904A1

    公开(公告)日:2024-01-25

    申请号:US18352646

    申请日:2023-07-14

    CPC classification number: G03F7/0045 C07D417/06 C07D275/06

    Abstract: A photoactive compound including an organic cation; and an anion represented by Formula (1):




    wherein X is an organic group; Y1 and Y2 are each independently a non-hydrogen substituent; Y1 and Y2 together optionally form a ring; Z2 is hydrogen, halogen, substituted or unsubstituted C1-30 alkyl, substituted or unsubstituted C3-30 cycloalkyl, substituted or unsubstituted C3-30 heterocycloalkyl, substituted or unsubstituted C6-50 aryl, substituted or unsubstituted C7-50 arylalkyl, substituted or unsubstituted C7-50 alkylaryl, substituted or unsubstituted C6-50 aryloxy, substituted or unsubstituted C3-30 heteroaryl, substituted or unsubstituted C4-30 alkylheteroaryl, substituted or unsubstituted C4-30 heteroarylalkyl, or substituted or unsubstituted C3-30 heteroaryloxy; Z2 optionally further comprises one or more divalent linking groups as part of its structure; Z2 and one of Y1 or Y2 together optionally form a ring; X and Z2 together optionally form a ring; and X and one of Y1 or Y2 together optionally form a ring.

    Gap-filling method
    5.
    发明授权

    公开(公告)号:US11042093B2

    公开(公告)日:2021-06-22

    申请号:US16167568

    申请日:2018-10-23

    Abstract: A method of manufacturing a semiconductor device comprising: providing a semiconductor device substrate having a relief image on a surface of the substrate, the relief image having a plurality of gaps to be filled; applying a coating composition to the relief image to provide a coating layer, wherein the coating composition comprises (i) a polyarylene oligomer comprising as polymerized units one or more first monomers having two or more cyclopentadienone moieties and one or more second monomers having an aromatic moiety and two or more alkynyl moieties; wherein the polyarylene oligomer has a Mw of 1000 to 6000 Da, a PDI of 1 to 2, and a molar ratio of total first monomers to total second monomers of 1:>1; and (ii) one or more organic solvents; curing the coating layer to form a polyarylene film; patterning the polyarylene film; and transferring the pattern to the semiconductor device substrate.

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