Invention Application
- Patent Title: MICRO PATTERNS CREATED ON THE SURFACE TO CONTROL PLACEMENT AND UNIFORMITY OF MATERIAL WITH VISCOSITY
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Application No.: US17125505Application Date: 2020-12-17
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Publication No.: US20220199881A1Publication Date: 2022-06-23
- Inventor: Asako TODA
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L33/58 ; H01L25/075 ; G02B6/42
Abstract:
Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate and a compute die on the package substrate. In an embodiment, an optics die is on the package substrate, and an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, channels are disposed on a surface of the IHS facing the package substrate.
Public/Granted literature
- US12176474B2 Micro patterns created on the surface to control placement and uniformity of material with viscosity Public/Granted day:2024-12-24
Information query
IPC分类:
