公开(公告)号：US20230194805A1

公开(公告)日：2023-06-22

申请号：US17553227

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Asako TODA

IPC: G02B6/42 ,  G02B6/02

CPC classification number: G02B6/422 ,  G02B6/4243 ,  G02B6/021 ,  G02B6/4284

Abstract: Embodiments disclosed herein include an optical fiber. In an embodiment, the optical fiber comprises a core and a cladding around the core. In an embodiment, a first rod is within the cladding and adjacent to the core. In an embodiment, the first rod comprises a magnetic material. In an embodiment, the optical fiber further comprises a second rod within the cladding and adjacent to the core, where the first rod and the second rod are on opposite sides of the core.

公开(公告)号：US20220196935A1

公开(公告)日：2022-06-23

申请号：US17131682

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Nitin DESHPANDE ,  Omkar KARHADE ,  Asako TODA ,  Divya PRATAP ,  Zhichao ZHANG

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a package substrate, and a compute die over the package substrate. In an embodiment, a photonics die is also over the package substrate, and the photonics die overhangs an edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the photonics die, and a fiber connector is coupled to the photonics die. In an embodiment, the fiber connector is attached to the IHS

公开(公告)号：US20220199881A1

公开(公告)日：2022-06-23

申请号：US17125505

申请日：2020-12-17

Applicant: Intel Corporation

Inventor： Asako TODA

IPC: H01L33/64 ,  H01L33/58 ,  H01L25/075 ,  G02B6/42

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate and a compute die on the package substrate. In an embodiment, an optics die is on the package substrate, and an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, channels are disposed on a surface of the IHS facing the package substrate.

公开(公告)号：US20220196939A1

公开(公告)日：2022-06-23

申请号：US17125497

申请日：2020-12-17

Applicant: Intel Corporation

Inventor： Asako TODA

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical connectors for photonic packages. In an embodiment an optical connector comprises a socket and a ferrule inserted into the socket. In an embodiment, the optical connector further comprises a first row of optical fibers in the ferrule, and a second row of optical fibers in the ferrule over the first row. In an embodiment, the optical connector further comprises a fiber distribution housing where the first row of optical fibers and the second row of optical fibers are spread laterally within the fiber distribution housing.

公开(公告)号：US20220196941A1

公开(公告)日：2022-06-23

申请号：US17125481

申请日：2020-12-17

Applicant: Intel Corporation

Inventor： Asako TODA ,  Chia-Pin CHIU ,  Xiaoqian LI ,  Yiqun BAI

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate