Invention Application
- Patent Title: COAXIAL TRANSMISSION LINE SLI SOCKET DESIGNS FOR 224GBS AND BEYOND
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Application No.: US17131686Application Date: 2020-12-22
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Publication No.: US20220200178A1Publication Date: 2022-06-23
- Inventor: Feifei CHENG , Zhe CHEN , Ahmet C. DURGUN , Zhichao ZHANG
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R12/70 ; H01R33/76 ; H01R13/6594 ; H01R13/24 ; H01R13/6585 ; H01R13/6597

Abstract:
In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.
Public/Granted literature
- US12126103B2 Coaxial transmission line SLI socket designs for 224GBS and beyond Public/Granted day:2024-10-22
Information query