公开(公告)号：US20220200178A1

公开(公告)日：2022-06-23

申请号：US17131686

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Feifei CHENG ,  Zhe CHEN ,  Ahmet C. DURGUN ,  Zhichao ZHANG

IPC: H01R12/71 ,  H01R12/70 ,  H01R33/76 ,  H01R13/6594 ,  H01R13/24 ,  H01R13/6585 ,  H01R13/6597

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.

公开(公告)号：US20210272892A1

公开(公告)日：2021-09-02

申请号：US16804516

申请日：2020-02-28

Applicant: Intel Corporation

Inventor： Zhichao ZHANG ,  Zhe CHEN ,  Srikant NEKKANTY ,  Sriram SRINIVASAN

IPC: H01L23/498 ,  H01L23/58

Abstract: Embodiments include assemblies. An assembly includes a substrate having a first interconnect and a second interconnect. The first interconnect has a first conductive pad and a second conductive pad, and the second interconnect has a third conductive pad and a fourth conductive pad. The assembly includes a socket over the substrate. The socket has a first pin, a second pin, and a base layer with a first pad and a second pad. The first and second pins are vertically over the respective first and second interconnects. The first pad is directly coupled to the first pin and fourth conductive pad, while the second pad is directly coupled to the second pin and second conductive pad. The first pad is positioned partially within a footprint of the third conductive pad, and the second pad is positioned partially within a footprint of the first conductive pad.