Invention Application
- Patent Title: 3D-FERROELECTRIC RANDOM (3D-FRAM) WITH BURIED TRENCH CAPACITORS
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Application No.: US17134281Application Date: 2020-12-26
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Publication No.: US20220208778A1Publication Date: 2022-06-30
- Inventor: Nazila HARATIPOUR , Sou-Chi CHANG , Shriram SHIVARAMAN , Jason PECK , Uygar E. AVCI , Jack T. KAVALIEROS
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/11514
- IPC: H01L27/11514 ; H01L27/11504 ; H01L27/11507 ; G11C7/18 ; G11C8/14 ; H01L29/78 ; H01L29/51 ; H01L29/66

Abstract:
A memory device comprises a series of alternating plate lines and an insulating material over a substrate. Two or more ferroelectric capacitors are through the series of alternating plate lines and an insulating material such that a first one of the ferroelectric capacitors is coupled to a first one of the plate lines and a second one of the ferroelectric capacitors is coupled to a second one of the plate lines. A plurality of substantially parallel bitlines is along a first direction over the two or more ferroelectric capacitors. A plurality of substantially parallel bitlines is along a first direction over the two or more ferroelectric capacitors. A plurality of substantially parallel wordlines is along a second direction orthogonal to the first direction over the two or more ferroelectric capacitors. An access transistor is located over and controls the two or more ferroelectric capacitors, the access transistor incorporating a first one of the bitlines and a first one of the wordlines. The bitline comprise a first source/drain of a source/drain pair, and a second source/drain is aligned, and in contact, with a top one of the two or more ferroelectric capacitors, and the first wordline forms a gate of the access transistor.
Information query
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