Invention Application
- Patent Title: ARRANGEMENT OF POWER-GROUNDS IN PACKAGE STRUCTURES
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Application No.: US17394213Application Date: 2021-08-04
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Publication No.: US20220230981A1Publication Date: 2022-07-21
- Inventor: Ting-Yu Yeh , Chun-Hua Chang , Fong-Yuan Chang , Jyh Chwen Frank Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.
Public/Granted literature
- US11929340B2 Arrangement of power-grounds in package structures Public/Granted day:2024-03-12
Information query
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