公开(公告)号：US11929340B2

公开(公告)日：2024-03-12

申请号：US17394213

申请日：2021-08-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ting-Yu Yeh ,  Chun-Hua Chang ,  Fong-Yuan Chang ,  Jyh Chwen Frank Lee

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L24/20 ,  H01L24/19 ,  H01L21/568 ,  H01L24/13 ,  H01L2224/13024 ,  H01L2224/19 ,  H01L2224/221

Abstract: A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.

公开(公告)号：US20220230981A1

公开(公告)日：2022-07-21

申请号：US17394213

申请日：2021-08-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ting-Yu Yeh ,  Chun-Hua Chang ,  Fong-Yuan Chang ,  Jyh Chwen Frank Lee

IPC: H01L23/00

Abstract: A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.

公开(公告)号：US20240178177A1

公开(公告)日：2024-05-30

申请号：US18428934

申请日：2024-01-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ting-Yu Yeh ,  Chun-Hua Chang ,  Fong-Yuan Chang ,  Jyh Chwen Frank Lee

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/20 ,  H01L24/19 ,  H01L21/568 ,  H01L24/13 ,  H01L2224/13024 ,  H01L2224/19 ,  H01L2224/221

Abstract: A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.