Invention Application
- Patent Title: Optoelectronic Device Mounting Structure with Embedded Heatsink Element
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Application No.: US17715238Application Date: 2022-04-07
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Publication No.: US20220231199A1Publication Date: 2022-07-21
- Inventor: Michael Shur , Grigory Simin , Alexander Dobrinsky
- Applicant: Sensor Electronic Technology, Inc.
- Applicant Address: US SC Columbia
- Assignee: Sensor Electronic Technology, Inc.
- Current Assignee: Sensor Electronic Technology, Inc.
- Current Assignee Address: US SC Columbia
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L27/12 ; H01L33/64 ; H01L33/62 ; H01L27/15
Abstract:
A mounting structure for mounting a set of optoelectronic devices is provided. A mounting structure for a set of optoelectronic devices can include: a body formed of an insulating material; and a heatsink element embedded within the body. A heatsink can be located adjacent to the mounting structure. The set of optoelectronic devices can be mounted on a side of the mounting structure opposite of the heatsink.
Information query
IPC分类:
