Invention Application
- Patent Title: SELECTIVE LOW TEMPERATURE EPITAXIAL DEPOSITION PROCESS
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Application No.: US17231087Application Date: 2021-04-15
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Publication No.: US20220238650A1Publication Date: 2022-07-28
- Inventor: Chen-Ying WU , Abhishek DUBE , Yi-Chiau HUANG
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/66 ; H01L29/167 ; H01L21/02 ; H01L21/225

Abstract:
A method for the selective formation of epitaxial layers is described herein. In the method, epitaxial layers are deposited to form source and drain regions around a horizontal gate all around (hGAA structure). The method includes co-flowing a combination of chlorinated silicon containing precursors, antimony containing precursors, and n-type dopant precursors. The resulting source and drain regions are selectively grown from crystalline nanosheets or nanowires of the hGAA structure over the non-crystalline gate structure and dielectric layers. The source and drain regions are predominantly grown in a direction.
Public/Granted literature
- US11843033B2 Selective low temperature epitaxial deposition process Public/Granted day:2023-12-12
Information query
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