Invention Grant
- Patent Title: Selective low temperature epitaxial deposition process
-
Application No.: US17231087Application Date: 2021-04-15
-
Publication No.: US11843033B2Publication Date: 2023-12-12
- Inventor: Chen-Ying Wu , Abhishek Dube , Yi-Chiau Huang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/66 ; H01L29/167 ; H01L21/02 ; H01L21/225 ; H01L29/423 ; H01L29/775 ; H01L29/786 ; H01L29/06

Abstract:
A method for the selective formation of epitaxial layers is described herein. In the method, epitaxial layers are deposited to form source and drain regions around a horizontal gate all around (hGAA structure). The method includes co-flowing a combination of chlorinated silicon containing precursors, antimony containing precursors, and n-type dopant precursors. The resulting source and drain regions are selectively grown from crystalline nanosheets or nanowires of the hGAA structure over the non-crystalline gate structure and dielectric layers. The source and drain regions are predominantly grown in a direction.
Public/Granted literature
- US20220238650A1 SELECTIVE LOW TEMPERATURE EPITAXIAL DEPOSITION PROCESS Public/Granted day:2022-07-28
Information query
IPC分类: