Invention Application
- Patent Title: SEMICONDUCTOR COMPONENT INCLUDING A DIELECTRIC LAYER
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Application No.: US17614706Application Date: 2020-06-23
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Publication No.: US20220238791A1Publication Date: 2022-07-28
- Inventor: Daniel Monteiro Diniz Reis , Daniel Pantel , Frank Schatz , Jochen Tomaschko , Mathias Mews , Timo Schary
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Priority: DE102019209964.5 20190705,DE102019209965.3 20190705,DE102019210032.5 20190708,DE102019210033.3 20190708
- International Application: PCT/EP2020/067568 WO 20200623
- Main IPC: H01L41/187
- IPC: H01L41/187 ; H01L41/316 ; H01L41/08

Abstract:
A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. A first defect type and a second defect type, which is different from the first defect type, are also present in dielectric layer. The at least two different defect types accumulate at one of the two electrodes as a function of a main operating voltage applied between the first electrode and the second electrode, and of a main operating temperature that is present at characteristic times τ1 and τ2, and generate the maximum changes in barrier height δΦ1 and δΦ2 at the electrodes. τ1 and δΦ1 are associated with the first defect type, and τ2 and δΦ2 are associated with the second defect type. τ1
Information query
IPC分类: