公开(公告)号：US20220238791A1

公开(公告)日：2022-07-28

申请号：US17614706

申请日：2020-06-23

Applicant: Robert Bosch GmbH

Inventor： Daniel Monteiro Diniz Reis ,  Daniel Pantel ,  Frank Schatz ,  Jochen Tomaschko ,  Mathias Mews ,  Timo Schary

IPC: H01L41/187 ,  H01L41/316 ,  H01L41/08

Abstract: A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. A first defect type and a second defect type, which is different from the first defect type, are also present in dielectric layer. The at least two different defect types accumulate at one of the two electrodes as a function of a main operating voltage applied between the first electrode and the second electrode, and of a main operating temperature that is present at characteristic times τ1 and τ2, and generate the maximum changes in barrier height δΦ1 and δΦ2 at the electrodes. τ1 and δΦ1 are associated with the first defect type, and τ2 and δΦ2 are associated with the second defect type. τ1

公开(公告)号：US20220231219A1

公开(公告)日：2022-07-21

申请号：US17612677

申请日：2020-06-23

Applicant: Robert Bosch GmbH

Inventor： Daniel Monteiro Diniz Reis ,  Daniel Pantel ,  Frank Schatz ,  Jochen Tomaschko ,  Mathias Mews ,  Timo Schary

IPC: H01L41/09 ,  H01L41/316 ,  H01L41/187 ,  H01L41/047 ,  H01L41/08

Abstract: A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. In addition, at least two defect types different from one another are present in the dielectric layer. These at least two defect types different from one another move along localized defect states, each at an average effective distance, in the direction of one of the two electrodes as a function of an operating voltage that is applied between the first electrode and the second electrode, and an operating temperature that is present. The average effective distance is greater than 3.2 nm.

公开(公告)号：US20170030857A1

公开(公告)日：2017-02-02

申请号：US15214057

申请日：2016-07-19

Applicant: Robert Bosch GmbH

Inventor： Daniel Pantel

IPC: G01N27/407

CPC classification number: G01N27/4073 ,  G01N27/407 ,  G01N27/4071

Abstract: A sensor element for acquiring at least one property of a measurement gas in a measurement gas compartment, in particular for acquiring a portion of a gas component in the measurement gas or a temperature of the measurement gas, includes a bearer element and at least one solid electrolyte layer. The solid electrolyte layer is situated on the bearer element. The solid electrolyte layer is at least partially epitaxially fashioned. The bearer element has at least one opening, so that the solid electrolyte layer has at least one membrane segment. In addition, a method is provided for producing such a sensor element.

Abstract translation: 一种用于获取测量气体隔室中的测量气体的至少一个特性的传感器元件，特别是用于获取测量气体中的气体成分的一部分或测量气体的温度，包括承载元件和至少一个固体 电解质层。 固体电解质层位于承载元件上。 固体电解质层至少部分地外延形成。 承载元件具有至少一个开口，使得固体电解质层具有至少一个膜段。 此外，提供了一种用于制造这种传感器元件的方法。

公开(公告)号：US08981513B2

公开(公告)日：2015-03-17

申请号：US14140930

申请日：2013-12-26

Applicant: Robert Bosch GmbH

Inventor： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Daniel Pantel ,  Frederik Ante ,  Johannes Kenntner

IPC: H01L31/0203 ,  H01L25/16 ,  B81B7/00 ,  H01L31/02 ,  H01L31/048 ,  H01L31/0216

CPC classification number: H01L25/167 ,  B81B7/00 ,  H01L23/58 ,  H01L25/16 ,  H01L31/02008 ,  H01L31/02167 ,  H01L31/048 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/1461 ,  Y02E10/50 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: An electrical circuit includes a solar cell that has a photovoltaically active front side and a back side. An electronic or micromechanical component is arranged on the back side of the solar cell and is electrically connected to the photovoltaically active front side of the solar cell by a contact-making structure. The electrical circuit also includes a transparent first protective layer that is arranged on the photovoltaically active front side of the solar cell. The contact-making structure has a first contact-making section that is arranged on a front side of the first protective layer facing away from the solar cell.

Abstract translation: 电路包括具有光电活性前侧和背面的太阳能电池。 电子或微机械部件布置在太阳能电池的背面，并通过接触结构电连接到太阳能电池的光伏活性前侧。 电路还包括布置在太阳能电池的光伏活性正面上的透明第一保护层。 接触制造结构具有第一接触部，其布置在背离太阳能电池的第一保护层的前侧。

公开(公告)号：US20180192204A1

公开(公告)日：2018-07-05

申请号：US15861787

申请日：2018-01-04

Applicant: Robert Bosch GmbH

Inventor： Ahmad Mansour ,  Daniel Pantel ,  Fabian Purkl ,  Kerrin Doessel ,  Thomas Buck ,  Thomas Northemann

IPC: H04R17/02 ,  H04R17/00 ,  H04R31/00 ,  B81B3/00

CPC classification number: H04R17/025 ,  B81B3/0051 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0118 ,  H04R17/005 ,  H04R31/006

Abstract: A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.

公开(公告)号：US10012828B2

公开(公告)日：2018-07-03

申请号：US15307433

申请日：2015-04-27

Applicant: Robert Bosch GmbH

Inventor： Frank Schatz ,  Friedjof Heuck ,  Kerrin Doessel ,  Stefan Pinter ,  Daniel Pantel ,  Franziska Rohlfing

IPC: G02B7/182 ,  G02B26/08 ,  B81B7/00 ,  G02B27/00 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B7/0067 ,  B81B2201/042 ,  G02B7/1821 ,  G02B26/101 ,  G02B27/0006

Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

公开(公告)号：US20170324120A1

公开(公告)日：2017-11-09

申请号：US15525449

申请日：2015-09-28

Applicant: Robert Bosch GmbH

Inventor： Daniel Pantel ,  Fabian Henrici ,  Nicola Mingirulli

IPC: H01M10/48 ,  B81B3/00 ,  H01M10/0525

Abstract: The invention relates to a galvanic cell (2) comprising a housing (4) which is equipped with at least one cell coil or a cell stack and comprising a sensor (16) for detecting the pressure of the galvanic cell (2). The housing (4) has a recess which is formed from a through-opening between an interior and an exterior of the cell (2), and the sensor (16) is arranged outside of the cell (2) so as to be secured directly or indirectly to the cell. The sensor (16), in particular a micro electromechanical system, is in contact with the interior of the galvanic cell (2) via the recess. The invention additionally relates to a method for producing such a galvanic cell (2).

公开(公告)号：US20220388839A1

公开(公告)日：2022-12-08

申请号：US17770561

申请日：2020-10-12

Applicant: Robert Bosch GmbH

Inventor： Volker Becker ,  Franz Laermer ,  Daniel Pantel

IPC: B81C1/00 ,  B01L3/00

Abstract: In a method for creating hydrophilic surfaces or surface regions on one or more silicon surfaces of a substrate, a vapour phase of hydrogen peroxide is generated in a reactor by heating an aqueous hydrogen peroxide solution. The substrate having the silicon surface or surfaces to be treated is exposed to the vapour phase, whereby a hydrophilisation of the silicon surfaces in achieved.

公开(公告)号：US10700392B2

公开(公告)日：2020-06-30

申请号：US15525449

申请日：2015-09-28

Applicant: Robert Bosch GmbH

Inventor： Daniel Pantel ,  Fabian Henrici ,  Nicola Mingirulli

IPC: B81B3/00 ,  H01M10/48 ,  H01M2/34 ,  H01M10/42 ,  H01M10/0525

Abstract: The invention relates to a galvanic cell (2) comprising a housing (4) which is equipped with at least one cell coil or a cell stack and comprising a sensor (16) for detecting the pressure of the galvanic cell (2). The housing (4) has a recess which is formed from a through-opening between an interior and an exterior of the cell (2), and the sensor (16) is arranged outside of the cell (2) so as to be secured directly or indirectly to the cell. The sensor (16), in particular a micro electromechanical system, is in contact with the interior of the galvanic cell (2) via the recess. The invention additionally relates to a method for producing such a galvanic cell (2).

公开(公告)号：US20170052364A1

公开(公告)日：2017-02-23

申请号：US15307433

申请日：2015-04-27

Applicant: Robert Bosch GmbH

Inventor： Frank Schatz ,  Friedjof Heuck ,  Kerrin Doessel ,  Stefan Pinter ,  Daniel Pantel ,  Franziska Rohlfing

IPC: G02B26/08 ,  G02B27/00 ,  G02B7/182

CPC classification number: G02B26/0833 ,  B81B7/0067 ,  B81B2201/042 ,  G02B7/1821 ,  G02B26/101 ,  G02B27/0006

Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

Abstract translation: 一种用于微镜芯片的组件主体，其部分地包围内部空腔，所述组件主体包括彼此远离的两个侧面，至少一个对于特定光谱为透明的相应部分外壁，并且所述组装体具有至少一个 可以安装有第一微反射镜芯片的第一外部开口和可以安装第二微反射镜芯片的第二外部开口，使得穿过第一部分外壁的光束能够被第一外部开口偏转 第一微镜芯片到第二微镜芯片上，并且能够被第二微镜芯片通过第二部分外壁偏转。 还描述了用于镜装置的镜装置和制造方法。