Invention Application
- Patent Title: LOCALIZED IMMERSION COOLING ENCLOSURE WITH THERMAL EFFICIENCY FEATURES
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Application No.: US17156085Application Date: 2021-01-22
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Publication No.: US20220239198A1Publication Date: 2022-07-28
- Inventor: M. Baris Dogruoz , Mark Nowell , Yi Tang , Rakesh Chopra , Mandy Hin Lam
- Applicant: CISCO TECHNOLOGY, INC.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Main IPC: H02K9/22
- IPC: H02K9/22 ; H02K9/10 ; H02K9/26
Abstract:
In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.
Public/Granted literature
- US11647607B2 Localized immersion cooling enclosure with thermal efficiency features Public/Granted day:2023-05-09
Information query
