公开(公告)号：US20220225537A1

公开(公告)日：2022-07-14

申请号：US17145816

申请日：2021-01-11

申请人： CISCO TECHNOLOGY, INC.

发明人： Mark Nowell ,  M. Baris Dogruoz ,  Mandy Hin Lam ,  Rakesh Chopra

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/44

摘要： In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

公开(公告)号：US20230209767A1

公开(公告)日：2023-06-29

申请号：US18178686

申请日：2023-03-06

申请人： Cisco Technology, Inc.

发明人： M. Baris Dogruoz ,  Mark Nowell ,  Yi Tang ,  Rakesh Chopra ,  Mandy Hin Lam

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K7/20236 ,  H05K1/0203 ,  H05K1/0272 ,  H05K7/20627 ,  H05K7/2089 ,  H05K2201/064 ,  H05K7/20636

摘要： In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

公开(公告)号：US11357132B2

公开(公告)日：2022-06-07

申请号：US16922177

申请日：2020-07-07

申请人： Cisco Technology, Inc.

发明人： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC分类号： H05K7/20 ,  H05K7/14 ,  G02B6/42 ,  H01R13/518

摘要： Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US20210231890A1

公开(公告)日：2021-07-29

申请号：US16922383

申请日：2020-07-07

申请人： Cisco Technology, Inc.

发明人： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC分类号： G02B6/42 ,  H01R13/518

摘要： Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US11917793B2

公开(公告)日：2024-02-27

申请号：US17145816

申请日：2021-01-11

申请人： CISCO TECHNOLOGY, INC.

发明人： Mark Nowell ,  M. Baris Dogruoz ,  Mandy Hin Lam ,  Rakesh Chopra

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/44

CPC分类号： H05K7/20236 ,  G06F1/20 ,  H01L23/44

摘要： In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

公开(公告)号：US11647607B2

公开(公告)日：2023-05-09

申请号：US17156085

申请日：2021-01-22

申请人： CISCO TECHNOLOGY, INC.

发明人： M. Baris Dogruoz ,  Mark Nowell ,  Yi Tang ,  Rakesh Chopra ,  Mandy Hin Lam

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K7/20236 ,  H05K1/0203 ,  H05K1/0272 ,  H05K7/2089 ,  H05K7/20627 ,  H05K7/20636 ,  H05K2201/064

摘要： In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

公开(公告)号：US11523541B2

公开(公告)日：2022-12-06

申请号：US16928279

申请日：2020-07-14

申请人： Cisco Technology, Inc.

发明人： M. Baris Dogruoz ,  Mandy Hin Lam ,  Mark Nowell ,  Rakesh Chopra

IPC分类号： H05K7/20 ,  F28F13/00 ,  G02B6/42 ,  H01R13/514

摘要： Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

公开(公告)号：US20230124658A1

公开(公告)日：2023-04-20

申请号：US17976276

申请日：2022-10-28

申请人： Cisco Technology, Inc.

发明人： M. Baris Dogruoz ,  Mandy Hin Lam ,  Mark Nowell ,  Rakesh Chopra

IPC分类号： H05K7/20 ,  F28F13/00

摘要： Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

公开(公告)号：US11439041B2

公开(公告)日：2022-09-06

申请号：US16922383

申请日：2020-07-07

申请人： Cisco Technology, Inc.

发明人： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC分类号： H01R13/00 ,  H05K7/20 ,  H05K7/14 ,  G02B6/42 ,  H01R13/518

摘要： Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US20220239198A1

公开(公告)日：2022-07-28

申请号：US17156085

申请日：2021-01-22

申请人： CISCO TECHNOLOGY, INC.

发明人： M. Baris Dogruoz ,  Mark Nowell ,  Yi Tang ,  Rakesh Chopra ,  Mandy Hin Lam

IPC分类号： H02K9/22 ,  H02K9/10 ,  H02K9/26

摘要： In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.