Invention Application
- Patent Title: THERMAL CONDUCTIVE SHEET AND METHOD FOR PRODUCING THE SAME, AND HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE
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Application No.: US17595453Application Date: 2021-05-13
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Publication No.: US20220240411A1Publication Date: 2022-07-28
- Inventor: Keisuke MUKASA , Yusuke Kubo , Keisuke Aramaki
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Shimotsuke-shi, Tochigi
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Shimotsuke-shi, Tochigi
- Priority: JP2020-093403 20200528,JP2021-080421 20210511
- International Application: PCT/JP2021/018208 WO 20210513
- Main IPC: H05K7/20
- IPC: H05K7/20 ; C09K5/14 ; C08K13/04

Abstract:
A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100≥80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.
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