公开(公告)号：US12233493B2

公开(公告)日：2025-02-25

申请号：US18276497

申请日：2022-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Mukasa ,  Yusuke Kubo ,  Keisuke Aramaki

IPC: B23P15/26 ,  B29C43/00 ,  B29C43/56 ,  F28F3/00

Abstract: A method for producing a heat transfer sheet, includes: (A1) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B1) slicing the molded body into a sheet shape to obtain a molded sheet; (C1) pressing the molded sheet; and (D1), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.

公开(公告)号：US20220240411A1

公开(公告)日：2022-07-28

申请号：US17595453

申请日：2021-05-13

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke MUKASA ,  Yusuke Kubo ,  Keisuke Aramaki

IPC: H05K7/20 ,  C09K5/14 ,  C08K13/04

Abstract: A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100≥80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.

公开(公告)号：US11929303B2

公开(公告)日：2024-03-12

申请号：US16973035

申请日：2019-06-19

Applicant: Dexerials Corporation

Inventor： Yusuke Kubo ,  Sergey Bolotov

IPC: H01L21/56 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433

CPC classification number: H01L23/4334 ,  H01L21/56 ,  H01L23/367 ,  H01L23/3733

Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor element 30; a conductive cooling member 40 provided above the semiconductor element 30, a conductive thermally conductive member 10 that is provided between the semiconductor element 30 and the cooling member 40 and contains a cured resin. The conductive thermally conductive member 10 is connected to a ground 60 in the substrate 50 to electrically connect the cooling member 40 and the ground 60.

公开(公告)号：US11742258B2

公开(公告)日：2023-08-29

申请号：US17617238

申请日：2021-04-23

Applicant: DEXERIALS CORPORATION

Inventor： Yuma Sato ,  Keisuke Aramaki ,  Yusuke Kubo

IPC: C08J5/18 ,  H01L23/373 ,  B29C48/00 ,  C08J5/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  B29K101/10 ,  B29K101/12 ,  B29K509/04 ,  B82Y30/00

CPC classification number: H01L23/3737 ,  B29C48/0021 ,  B29C48/022 ,  C08J5/042 ,  C08J5/18 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2509/04 ,  B29K2995/0013 ,  B29K2995/0094 ,  B82Y30/00 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005

Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.

公开(公告)号：US11329005B2

公开(公告)日：2022-05-10

申请号：US16973765

申请日：2019-06-19

Applicant: Dexerials Corporation

Inventor： Sergey Bolotov ,  Yusuke Kubo

IPC: H01L23/552 ,  H01L23/367 ,  H01L23/373 ,  H01L21/48

Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor device 30; a tubular conductive shield can 20 provided to surround a side surface 30a of the semiconductor device 30; a conductive cooling member 40; and a conductive thermally conductive sheet 10 formed between the semiconductor device 30 and the cooling member 40. The conductive shield can 20 and the cooling member 40 are electrically connected through the conductive thermally conductive sheet 10 therebetween.

公开(公告)号：US11315889B2

公开(公告)日：2022-04-26

申请号：US17053248

申请日：2019-06-18

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke Kubo ,  Sergey Bolotov

IPC: H01L23/60 ,  H01L23/367 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01P3/08

Abstract: Provided is an electronic device capable of simultaneously achieving heat dissipation, electromagnetic wave suppression effect and ESD protection at a high level. The device includes: an electronic component 30 provided on a substrate 31; an electrically conductive shielding can 20 having an opening 21 and provided so as to surround the electronic component 30 and connected to a ground 32; an electrically conductive cooling member 40 provided on the top of the electrically conductive shielding can 20; a thermally and electrically conductive sheet 10 provided between the electronic component 30 and the electrically conductive cooling member 40; and an insulating member 50 provided between the thermally and electrically conductive sheet 10 and the electrically conductive cooling member 40 and facing the electronic component 30 through the opening 21, wherein the insulating member 50 has a size equal to or larger than the region of the electronic component 30 facing through the opening 21, and the electrically conductive shielding can 20 and the electrically conductive cooling member 40 are electrically connected through the thermally and electrically conductive sheet 10.

公开(公告)号：US10892204B2

公开(公告)日：2021-01-12

申请号：US16085263

申请日：2017-03-24

Applicant: Dexerials Corporation

Inventor： Tatsuo Kumura ,  Yusuke Kubo ,  Keisuke Aramaki ,  Hiroyuki Ryoson

IPC: H01L23/36 ,  H05K9/00 ,  H01L23/42 ,  H01L23/552 ,  H01L23/373 ,  H05K7/20 ,  H01L23/28

Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.

公开(公告)号：US10002704B2

公开(公告)日：2018-06-19

申请号：US14649388

申请日：2013-11-27

Applicant: DEXERIALS CORPORATION

Inventor： Tatsuo Kumura ,  Yusuke Kubo

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/255 ,  H01F38/14 ,  H01Q1/40 ,  H01Q7/06 ,  H01F27/36 ,  H01F17/04

CPC classification number: H01F27/2885 ,  H01F5/00 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/2871 ,  H01F27/29 ,  H01F27/365 ,  H01F38/14 ,  H01F2017/048 ,  H01Q1/40 ,  H01Q7/06

Abstract: A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.

公开(公告)号：US11597196B2

公开(公告)日：2023-03-07

申请号：US17424596

申请日：2020-01-21

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke Kubo ,  Keisuke Aramaki

IPC: B32B37/18 ,  B32B7/027 ,  B29C70/58 ,  B32B27/20 ,  B32B27/28 ,  B29K83/00 ,  B29K307/04 ,  B29L7/00 ,  F28F21/06 ,  H01L23/373

Abstract: A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.