Invention Application
- Patent Title: MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICES AND INTEGRATED ON AN INTER DIE FABRIC
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Application No.: US17721241Application Date: 2022-04-14
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Publication No.: US20220246554A1Publication Date: 2022-08-04
- Inventor: Telesphor KAMGAING , Georgios C. DOGIAMIS , Vijay K. NAIR , Javier A. FALCON , Shawna M. LIFF , Yoshihiro TOMITA
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/48 ; H01L23/538 ; H01L23/00 ; H01L23/498 ; H01L23/552 ; H01L25/10 ; H01L25/16
Abstract:
Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
Information query
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