Invention Application
- Patent Title: SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING
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Application No.: US17731498Application Date: 2022-04-28
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Publication No.: US20220254559A1Publication Date: 2022-08-11
- Inventor: Srinivas Venkata Ramanuja Pietambaram , Kristof Darmawikarta , Gang Duan , Yonggang Li , Sameer Paital
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01F27/26
- IPC: H01F27/26 ; H01F27/42 ; H01L21/768 ; H01L23/64

Abstract:
Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.
Public/Granted literature
- US12230430B2 Substrate embedded magnetic core inductors and method of making Public/Granted day:2025-02-18
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