Invention Application
- Patent Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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Application No.: US17631900Application Date: 2020-07-20
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Publication No.: US20220270926A1Publication Date: 2022-08-25
- Inventor: Yasutaka MIZOMOTO
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2019-143300 20190802
- International Application: PCT/JP2020/028011 WO 20200720
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/67 ; H01L21/02
Abstract:
A substrate processing method includes preparing a stacked substrate including a first substrate divided into multiple chips, a protective film divided for each of the multiple chips to protect the chip, a second substrate supporting the first substrate, and an adhesive film configured to attach the protective film and the second substrate; reducing adhesive strength of the adhesive film with a light beam configured to penetrate the second substrate; and picking-up, from the adhesive film by a pick-up device, the chip and the protective film with the reduced adhesive strength to the adhesive film.
Information query
IPC分类:
