Invention Application
- Patent Title: COVER LAMINATED WITH MULTILAYER FILM, ELECTRONIC DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING MULTILAYER FILM
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Application No.: US17678915Application Date: 2022-02-23
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Publication No.: US20220272856A1Publication Date: 2022-08-25
- Inventor: Jeamoon JUNG , Jayeun KO , Hokyung MOON , Taehyun SONG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0024198 20210223
- Main IPC: H05K5/03
- IPC: H05K5/03

Abstract:
Disclosed is an electronic device including a cover defining a portion of an external appearance of the electronic device, a film layer attached to a first surface of the cover, at least one UV molding pattern layer disposed on the film layer, wherein the at least one UV molding pattern layer includes a first area, and a second area that is different from the first area, a thermally cured printing layer disposed on the first area of the at least one UV molding pattern layer, and a deposition layer including a first part disposed to overlap the first area of the at least one UV molding pattern layer, and a second part disposed in the second area of the at least one UV molding pattern layer.
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