Invention Application
- Patent Title: SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM, AND MEMORY MEDIUM
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Application No.: US17745998Application Date: 2022-05-17
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Publication No.: US20220277968A1Publication Date: 2022-09-01
- Inventor: Miyako KANEKO , Keiji TANOUCHI , Takehiko ORII , Itaru KANNO , Meitoku AIBARA , Satoru TANAKA
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP TOKYO
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP TOKYO
- Priority: JP2013-234843 20131113,JP2014-163839 20140811
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02
Abstract:
A method for cleaning a substrate includes supplying, to a substrate which does not have a resist formed thereon, a film-forming processing liquid which includes a volatile component and forms a processing film, volatilizing the volatile component of the film-forming processing liquid such that the film-forming processing liquid on the substrate is solidified or cured and that the processing film is formed on the substrate, heating a peeling processing liquid which peels off the processing film from the substrate without dissolving the processing film such that a heated peeling processing liquid is prepared, and supplying, to the processing film formed on the substrate, the heated peeling processing liquid such that the heated peeling processing liquid peels off the processing film from the substrate without dissolving the processing film.
Information query
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