Invention Application
- Patent Title: MULTI-LAYER INDUCTOR
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Application No.: US17693810Application Date: 2022-03-14
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Publication No.: US20220301761A1Publication Date: 2022-09-22
- Inventor: Akihiko OIDE , Makoto YOSHINO , Tomoki OKADA , Masashi SHIMOYASU , Daiki KATO , Hideki SAITOU , Seiji OSADA , Kazuhiro EBINA
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2021-043556 20210317
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F17/00

Abstract:
In the multi-layer inductor, a through conductor provided in a sintered element body includes a pair of extracting conductors and a pair of internal conductors, and an end portion of the extracting conductor and an end portion of the internal conductor overlap each other in a stacking direction of the element body. Thus, the amount of shrinkage of each conductor during sintering of the element body is reduced, and internal stress generated in the element body after sintering is prevented.
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