公开(公告)号：US20250069795A1

公开(公告)日：2025-02-27

申请号：US18941111

申请日：2024-11-08

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Mamoru KAWAUCHI ,  Shigetoshi KINOUCHI ,  Mitsuru ITO ,  Yuto SHIGA

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil in the element body, a connection conductor in the element body, and an external electrode on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface positioned adjacent to the principal surface. The connection conductor includes one end connected to the coil and another end connected to the external electrode. The external electrode includes a sintered metal layer formed on the element body and a conductive resin layer formed on the sintered metal layer. The sintered metal layer includes a portion on the principal surface and a portion on the end surface. The portion on the principal surface has an average thickness smaller than an average thickness of the portion on the end surface.

公开(公告)号：US20230317351A1

公开(公告)日：2023-10-05

申请号：US18188534

申请日：2023-03-23

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Yoji TOZAWA ,  Akihiko OIDE ,  Daiki KATO ,  Midori KISHIMOTO ,  Satoshi TAKASU ,  Yo SAITO ,  Rui TAKAHASHI ,  Kenta SASAKI ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/292 ,  H01F2027/2809

Abstract: An electronic component has an element body; and an external electrode having a main body portion covering at least the second surface and a first wrapping-around portion wrapping around the third surface in the element body. The wrapping-around portion of the external electrode has a first part having a first distance, a second part having a second distance, a third part having a third distance, a fourth part having a fourth distance, and a fifth part having a fifth distance in the second direction in order from one side to the other side in the first direction. The second distance is longer than the first distance and the third distance. The fourth distance is longer than the third distance and the fifth distance.

公开(公告)号：US20240120142A1

公开(公告)日：2024-04-11

申请号：US18480760

申请日：2023-10-04

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Akihiko OIDE ,  Daiki KATO ,  Makoto YOSHINO ,  Takashi ENDO ,  Takuya KODAMA ,  Akira AKASAKA ,  Ken ITOH

IPC: H01F27/02 ,  H01F27/29

CPC classification number: H01F27/022 ,  H01F27/29

Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.

公开(公告)号：US20210383960A1

公开(公告)日：2021-12-09

申请号：US17337985

申请日：2021-06-03

Applicant: TDK CORPORATION

Inventor： Daiki KATO ,  Masashi SHIMOYASU ,  Yoji TOZAWA ,  Seiichi NAKAGAWA ,  Akihiko OIDE ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

Abstract: A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.

公开(公告)号：US20210375527A1

公开(公告)日：2021-12-02

申请号：US17329348

申请日：2021-05-25

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Daiki KATO ,  Yoji TOZAWA ,  Takashi ENDO ,  Seiichi NAKAGAWA ,  Mitsuru ITO ,  Kenta SASAKI ,  Akihiko OIDE ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04

Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.

公开(公告)号：US20240038436A1

公开(公告)日：2024-02-01

申请号：US18378815

申请日：2023-10-11

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Mamoru KAWAUCHI ,  Shigetoshi KINOUCHI ,  Mitsuru ITO ,  Yuto SHIGA

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/292 ,  H01F27/29 ,  H01F27/324 ,  H01F2027/2809

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US20220130594A1

公开(公告)日：2022-04-28

申请号：US17573301

申请日：2022-01-11

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Mamoru KAWAUCHI ,  Shigetoshi KINOUCHI ,  Mitsuru ITO

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US20200185144A1

公开(公告)日：2020-06-11

申请号：US16789893

申请日：2020-02-13

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Mamoru KAWAUCHI ,  Shigetoshi KINOUCHI ,  Mitsuru ITO

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29 ,  H01F17/00

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US20180137964A1

公开(公告)日：2018-05-17

申请号：US15814063

申请日：2017-11-15

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Junichi OTSUKA ,  Tsutomu ONO ,  Hidekazu SATO

IPC: H01F27/245 ,  H01F27/28 ,  H01F27/29

Abstract: An electronic component includes a body and a pair of terminal electrodes. The body has a pair of end faces opposing each other in a first direction, a pair of main faces opposing each other in a second direction, and a pair of side faces opposing each other in a third direction. One of the main faces serves as a mounting face. A clearance in the first direction between an end edge of a conductive resin layer and the end edge of a base metal layer at an end portion of the one of the main faces in the third direction is longer than a clearance in the first direction between the end edge of the conductive resin layer and the end edge of the base metal layer at a central portion of the one of the main faces in the third direction.

公开(公告)号：US20220301761A1

公开(公告)日：2022-09-22

申请号：US17693810

申请日：2022-03-14

Applicant: TDK CORPORATION

Inventor： Akihiko OIDE ,  Makoto YOSHINO ,  Tomoki OKADA ,  Masashi SHIMOYASU ,  Daiki KATO ,  Hideki SAITOU ,  Seiji OSADA ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F17/00

Abstract: In the multi-layer inductor, a through conductor provided in a sintered element body includes a pair of extracting conductors and a pair of internal conductors, and an end portion of the extracting conductor and an end portion of the internal conductor overlap each other in a stacking direction of the element body. Thus, the amount of shrinkage of each conductor during sintering of the element body is reduced, and internal stress generated in the element body after sintering is prevented.